Core view
MEMS is the basic component of hardware revival: MEMS is the direction of micro-innovation of mobile terminals, and has become the basis of new hardware such as wearable devices. We are optimistic that MEMS is expected to become the most promising electronic component in the next few years, indoor navigation. , background recognition, keyword recognition, full-time boot, full-time listening, more accurate motion recognition and other functions have put more demand on MEMS.
MEMS is rich in types, and many applications go hand in hand: MEMS has many advantages in many fields due to its low power consumption, small size, and excellent performance. In mobile terminals, inertial sensors and MEMS microphones have been widely used, but the usage is still increasing. The permeability of air pressure sensors and camera optical anti-shake OIS gyroscopes will also increase rapidly. In addition, MEMS autofocus and MEMS resonators New application markets such as MEMS speakers are also expected to open. Wearable devices are expected to grow in the next few years, and sensor usage will gradually increase barometers, gyroscopes, thermometers, hygrometers, microphones, etc. from simple single-axis accelerometers.
MEMS is moving towards large-scale division of labor, which is good for advanced packaging: MEMS industry is mainly controlled by vertically integrated IDM due to application dispersion. With the large-scale development of MEMS industry, the division of labor begins to appear in various links, and a large number of fabless designs The rise of the company has created opportunities for professional fabs and packaging and testing plants, and advanced packaging that significantly reduces size and cost is expected to benefit significantly. In current ceramic package, lead frame package, ball grid/grid array package, wafer level package and other solutions, wafer level package and ball grid / grid array package are the most promising, 3D wafer level package can also Integrate MEMS and ASIC to further increase efficiency and reduce size.
Investment suggestions and investment targets: We are optimistic about the extension of MEMS applications, and we recommend focusing on Goer Acoustics (002241, unrated). Goer's MEMS-based microphones have become one of the deepest companies in the domestic MEMS field, and pressure sensors have also been acquired. Breakthrough, is expected to benefit from the trend of air pressure sensing brought by the iPhone6.
Under the trend of MEMS advanced packaging, we recommend focusing on WLCSP/TSV technology of Jingfang Technology (603005, unrated) and Huatian Technology (002185, unrated).
Risk warning: MEMS market application is less than expected risk: competition increases risk
1. MEMS is the basic component of hardware revival
1.1 MEMS————The current direction of micro-innovation, the basis of wearable equipment
MEMS (Micro-Electro-Mechanical System) is a micro-circuit and micro-mechanical integration on the chip according to functional requirements. Based on semiconductor technology such as photolithography and etching, it integrates ultra-precision machining and combines materials, mechanics, chemistry, optics, etc. to make a millimeter. Or micron-scale MEMS systems with precise and complete electrical, mechanical, chemical, optical and other characteristics. After smartphones and tablets, innovations in the consumer electronics sector entered the platform period. Based on the number of CPU cores, screen size, resolution, camera pixels, and thinness, after the fierce competition in previous years, there was a concern about overperformance. Big companies are beginning to turn more energy into new features, new applications, and try to bring a better experience.
We believe that MEMS-based sensors and actuators will be the direction of micro-innovation in mobile terminals before the next major innovation (possibly wearable devices). The maturity of MEMS technology will also greatly promote wearable devices. development of.
a) MEMS is the current direction of micro-innovation of mobile terminals: on the one hand, new device forms (mobile terminals and even wearable devices) require more miniaturized devices and more convenient interaction methods. On the other hand, mobile computing and mobile internet Technology gives space and prospects for MEMS systems to be applied to new types of equipment.
b) MEMS lays the foundation for wearable devices: wearable devices will have more demand for MEMS than mobile terminals. The characteristics of wearable devices determine that it puts higher demands on the miniaturization and input and output methods of devices; Depending on the field of application, wearable devices need to maintain a sense of the environment, objects, and the human body.
1.2 The application field continues to expand
MEMS sensors began to enter the mobile terminal field with the iPhone in 2007, including inertial sensors—accelerators, gyroscopes, compasses (screen-oriented and navigation), OIS camera gyroscopes, etc. MEMS microphones also began to replace large-scale traditional Electret microphone. Apple's iPhone has greatly promoted the rapid spread of inertial sensors, MEMS microphones, proximity sensors, light sensors, etc., and each new sensor is added to the complete experience, which quickly improved the user experience and cultivated user habits.
As a result, MEMS sensors are rapidly spreading in markets other than mobile terminals, including gaming devices, wearable devices, smart TVs, health monitoring, automotive, LBS, and more. Features are also rapidly increasing, from inertial sensors, MEMS microphones to air pressure sensors, humidity, temperature, RF switches, distances, lights and micro-injection sensors, and the integration of three or even four-5 sensors also enhances MEMS sensor miniaturization The pace of multi-functionality.
We believe that MEMS is the most promising electronic component in the next few years. Indoor navigation, background recognition, keyword recognition, full-time boot, full-time listening, and more accurate motion recognition all add new demands to MEMS.
1.3 Mobile Terminals - New MEMS Sensors May Appear in the Next Year
Mobile terminals will be an important growth point for MEMS. In addition to the continued popularity and combination trend of inertial sensors, MEMS microphones and pressure sensors, the penetration rate of air sensor and camera optical anti-shake OIS gyroscope will also increase rapidly.
In addition, many new MEMS sensors are expected to appear on mobile terminals in the next few years, such as MEMS oscillators, switches, MEMS speakers, gas sensors, MEMS cameras, and micro-injections.
It is estimated that the average annual growth rate of the MEMS market on mobile terminals will reach 20% in 2012-2018. Pressure/temperature and humidity sensors, optical MEMS, etc. are the fastest growing.
1.4 The number of MEMS requirements for wearable devices is also increasing
In wearable devices, different devices correspond to different interactions and needs, so different sensors, such as inertial sensors, are needed to measure the time required for motion and to measure relevant data with higher accuracy.
In addition, the continuous improvement of functionality in wearable devices is also gradually increasing the number of MEMS sensors in wearable devices. At present, companies such as Apple and Samsung are very active in increasing mobile phone MEMS:
1) The first generation pedometer only has an accelerometer, which can only perform simple step counting and identification of walking and running;
2) The second-generation activity tracker has an accelerometer and a barometer to improve the step counting function, calorie consumption calculation, etc.
3) The current third-generation activity monitors include accelerometers, barometers, and gyroscopes that recognize complex movements such as running, swimming, and automobiles, and can accurately calculate calories;
4) Subsequent fourth-generation smart watches further add temperature, humidity and MEMS microphones to provide background recognition and personal assistant functions in addition to complex recognition activities.
2. Multiple applications in the MEMS market go hand in hand
2.1 MEMS types are rich and diverse
MEMS has the advantages of small size, light weight, low power consumption, good durability, low price and stable performance. The unique characteristics of MEMS system make it have potential application in many fields. Although there are many applications, MEMS as a whole The market is still in its infancy, and a large number of MEMS systems still have broad market potential.
MEMS by application mainly includes sensors, actuators, micro-energy, etc.:
Sensors: MEMS sensors are currently well-established MEMS devices, including pressure sensors (which can also measure air pressure and altitude through pressure sensors), inertial sensors (accelerometers, gyroscopes, geomagnetic sensors, or a combination of two-in-one and three-in-one). ), MEMS microphones, environmental sensors (temperature and humidity), heat radiation, etc. Among them, inertial sensors and MEMS microphones have become the standard equipment of new types of equipment. The application of sensors such as temperature, humidity and pressure on mobile terminals, especially some wearable devices, is also expected to spread rapidly.
Actuators: MEMS actuators also have some mature applications, such as flow control (inkjet head), BAW (Body Acoustic Wave) filters in RF devices, BAW duplexers, etc., but a large number of application scenarios in the future do not stop there. For example, MEMS oscillators/resonators, MEMS speakers, MEMS cameras, MEMS mirrors (for micro-injection fields), and the like.
Micro-energy: MEMS fuel cells have high energy density. Replacing current mobile phone batteries with MEMS fuel cells can extend the theoretical life time to several weeks, but the current cost is as high as $300, and there is still a long way to go.
In 2010, driven by MEMS microphones and inertial sensors, the MEMS market began to enter a rapid growth period, and CAGR will reach 13% in 2012-2018.
Among them, combined inertial sensors (2011-2017CAGR67%), microdisplays (93%), MEMS oscillators (64%), etc. will exhibit rapid growth.
2.2 Inertial sensors are still an important market, and combination has become a trend
Inertial sensors include accelerometers (linear accelerometers), gyroscopes (angle-measuring motion), and geomagnetic sensors (measurement directions). Traditional single-axis inertial sensors have been widely used in automotive control and other fields, but it was not until 2009 that three-axis MEMS inertial sensors appeared and began to be used on smartphones to control games or virtual reality, shake mobile phone input commands, and exercise. Information tracking, etc. Since then, the MEMS inertial sensor market has been detonated.
At present, 6-axis/9-axis (2-in-1, 3-in-1) is gradually becoming the mainstream, and the next generation of products will be integrated into pressure sensors. In the future, more and more sensors will be integrated into a larger trend, with higher integration. More functionality can be achieved, and the operating system and application layer will seamlessly interface from a single functional sensor to a combined function -- detecting motion and geography.
At present, the overall penetration rate of inertial sensors in mobile terminals has reached about half, which is almost standard. In addition to continuing penetration in mobile terminals in the future, it is also promising in wearable devices (brace, smart shoes, etc.).
The global consumer market for inertial sensors will grow from $1.76 billion in 2012 to $2.99 ​​billion in 2018, with discrete inertial sensors likely to face recession, and 6-axis/9-axis combined inertial sensors will usher in an explosion.
2.3 MEMS microphone
Knowles, Goer Acoustics, etc. have led the trend of MEMS microphones, and have replaced the traditional electret microphones in mobile terminals. The advantages of high quality, anti-interference and miniaturization make them work well on new hardware. Shipment growth rate reached 24% from 2012-2016.
The wearable device needs a microphone to read the user's voice information, and also needs a sound tube to output the signal of the device. In addition to simple voice call and other functions, in fact, the MEMS microphone is in speech recognition, background recognition (to figure out the state of the user), Applications such as keyword recognition are also very consistent with future trends. Sport plus voice recognition provides an Always-onalwayslisten experience. You can stay on and use these features anytime, anywhere. These features will soon be available on mobile phones and wearables.
2.4 optical image stabilization, auto focus
For smartphone users, a large demand for cameras is stable imaging. Although the camera pixels are getting higher and higher, they are prone to underexposure and blurred imaging in low light conditions. The OIS gyroscope is capable of stable imaging and produces high quality photos in less than ideal photo environments. The iPhone 6 camera adds OIS optical image stabilization, which is likely to lead the optical image stabilization trend.
Produce high quality photos. The iPhone 6 camera adds OIS optical image stabilization, which is likely to lead the optical image stabilization trend.
MEMS autofocus
MEMS autofocus corrects the deviation of the object distance and the deviation of the temperature from the lens. The autofocus device uses electrostatic force to accurately position and move the lens to focus for optimal positioning accuracy and repeatability. The mechanical interface of the autofocus unit precisely aligns the lens barrel with the moving lens.
The MEMS autofocus module has the performance advantages of MEMS technology, higher integration, faster focusing speed, more accurate focus and lower power consumption. The focus speed is significantly faster, at least 7 times faster than conventional VCM lenses; power consumption is only 1% of VCM lenses.
In addition, the z-axis height of the MEMS lens module is only 5.1mm, which is 33% less than the conventional VCM module. MEMS technology also allows the lens assembly to operate at low temperatures. Compared to conventional lenses, MEMS lenses can reduce heat dissipation by 20%, and temperatures are at least 10 degrees lower. Temperature control is useful for improving the stability of photo quality.
3. Optimistic about MEMS application extension and advanced packaging opportunities
3.1 MEMS market application cycle shortened, the industry chain from IDM to division of labor
MEMS device manufacturing process can be divided into MEMS manufacturing, packaging, testing, thinning, cutting, ASIC manufacturing, testing, thinning, cutting, MEMS and ASIC chip packaging, etc., the industry chain is more complex. In the past, the downstream application of MEMS was dispersed, and it was difficult to form a scale effect. Therefore, the MEMS industry is mainly controlled by a vertically integrated IDM.
With the gradual maturity of MEMS technology and the large demand generated by new devices (mobile terminals, wearable devices), the cycle of MEMS devices from research and development to commercialization is becoming shorter and shorter, from commercialization to large-scale application. It is gradually shortening.
In recent years, the beginning of the MEMS industry has led to the emergence of division of labor in all aspects of MEMS, especially the rise of fabless design companies such as Lou's Electronics (MEMS Microphone), InvenSense (Inertial Sensor), Sitime (MEMS Resonator), etc. Round factories and packaging and testing plants have brought opportunities.
Lou's Electronics, InvenSense, etc. have become among the top 30 manufacturers in the global MEMS field. At present, more than half of the MEMS business is still in the hands of IDM, but the division of labor after mass and standardization will become a trend.
3.2 Manufacturing links upgrade, advanced packaging benefits
In addition to promoting division of labor to increase efficiency and reduce costs, the rise of MEMS will also enable professional wafer manufacturers to produce with more advanced processes and larger wafers:
At present, mainstream MEMS manufacturers use 6-inch wafer 65nm process to produce MEMS, and the advanced process of IC has reached 12nm (Intel), 20nm (TSMC). At present, manufacturers have gradually produced MEMS using 8-inch wafers, and the process is expected to increase. The introduction of advanced processes will further promote the further improvement of MEMS performance, and continue to reduce power consumption, cost, size, etc., which is conducive to further explosion of the MEMS market.
For the packaging process, as new hardware such as wearable devices further increase the power consumption and volume requirements of MEMS systems, the packaging process requirements will continue to increase, so that advanced packaging that can significantly reduce size and cost (especially applicable) The 3D wafer level package for MEMS chips will continue to benefit.
MEMS packages are different from traditional packages, and future 3D wafer-level packages and BGA/LGA packages are likely to have the most potential:
MEMS packaging is different from traditional packaging. Because MEMS packaging involves materials, electrical, mechanical and other components, it needs precise and complete electrical, mechanical, chemical, optical and other characteristics in a millimeter or micron MEMS system.
a) Special signal interface (including electrical, optical, magnetic, mechanical, temperature and other input signals)
b) special packaging materials: thermal expansion coefficient, thermal, electrical, anti-corrosion properties, mechanical stress, etc. of the packaging materials need to be considered;
c) Special three-dimensional structure: non-planar process, colloid, cantilever, film, etc.
d) special chip passivation requirements
e) Special reliability requirements: The essence of MEMS is mechanical motion, so chip protection must first consider mechanical vibration, acceleration and avoid various physical damage.
At present, MEMS packages mainly include ceramic package, lead frame package, ball grid/grid array package, wafer level package, etc. Among them, ceramic and lead frame packages are not suitable for miniaturized devices, and will remain stable in the future. BGA/LGA is the current mainstream. In the future, it will maintain rapid growth. Wafer-level packaging has the advantages of large quantities and miniaturization, which may usher in rapid growth.
Future 3D wafer-level packaging (TSV, etc.) is also expected to integrate MEMS and ASIC to further increase efficiency and reduce size. In 2012-2016, the average annual growth rate of MEMS wafer-level packaging will reach 37%, and BGA/LGA will remain at 16%.
For example, Invensense uses a 3D wafer-level package to directly connect the MEMS and ASIC chips without passing through the gold wire, achieving a smaller size, better performance, and improved efficiency and cost in the production process.
3.3 Suggestions focus on Goer, Jingfang, Huatian
Goer Acoustics is a company with deep accumulation in the domestic MEMS field. It has become the main packaging and application company of MEMS microphones in the world by supplying MEMS microphones for Apple headphones, etc. In addition to the promotion of MEMS microphones, MEMS equipped with single equipment The microphone is also on the rise.
In addition, Goer Acoustics will also benefit from the extension of MEMS system functions and applications. For example, the first time equipped with a barometric pressure sensor on the iPhone6, it is expected to drive the pressure sensor into a trend. The company's air pressure sensor has also achieved breakthroughs and will be expected to benefit from this trend in the future.
Under the trend of MEMS advanced packaging, we propose to pay attention to the WLCSP/TSV technology of Jingfang Technology and Huatian Technology, which is expected to become a fast-growing class in the MEMS packaging process. In addition, the Asahi Electronics (601231, unrated) SiP package is also suitable for post-heterogeneous integration.
4. Risk warning
The MEMS market application is less than expected:
We are optimistic about the application of MEMS from inertial sensors, MEMS microphones, etc. to air pressure, temperature sensors, OIS anti-shake, auto focus, etc., but also can not reach the user's pain points, the market response is less than expected risk.
Competitive risk
The MEMS market is currently in a rising stage, but some markets (such as single-axis inertial sensors) are increasingly competitive in the market.
Author: Orient Securities Kuai Jian Hu Yu mirror
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