Since LCD TVs with LED backlights emphasize thinness, parity, and versatility, the requirements for LED packaging are thinner and lower, and because of the need for diversified LED lighting applications, In order to achieve a brighter, higher color rendering and higher chroma concentration package, it is expected that the two technologies of plastic die load (PLCC) and COB (Chip On Board) will each be superior.
Yang Guangneng, director of the Electronic Display and Development Division of Power League, said that the unit price per kilowatt of lumens is a major key to the popularity of LED lighting.
Yang Guangneng, director of the electronic display R&D department of Power League, said that the market penetration rate of LED backlights under 26 inches has approached 100%. Compared with 2010, LED TV backlights in 2011 are more flat, cheaper and more versatile. As a result, LED packaging trends are becoming thinner, with a thickness of only 2 mm, and mainstream brightness requirements of more than 90 lumens per watt, higher-order products even up to 100 lumens per watt, and lower cost, less than $4 per thousand lumens, and support Touch, 3D and Local Dimming. Considering the price is the target of the end consumer purchase, the future side-light backlight is still the market main force, and the high-end model is the direct type.
Different from LED TV, LED packaging technology used in lighting field not only requires higher brightness, but also highlights high color rendering, high chroma concentration and low price advantage. Yang Guangneng pointed out that the brightness of mainstream LED package is 100 lumens per watt. The high-order products reach 110 lumens per watt, and the color rendering of cold and warm LEDs respectively appeals to 75 and 80, and the production cost must be less than 3.5 US dollars per thousand lumens; and achieve higher chroma concentration.
It is worth noting that even though PLCC packaging technology takes into account many advantages of COB, Yang Guangneng analyzes that compared with PLCC, it is suitable for applications with special requirements in size and brightness. COB is more advantageous in the field of surface light source, and optical design is easy and low. Assembly costs, plus no ghosting characteristics, so the future two major packaging technologies will have supporters in the LED lighting market.
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