
The LC898111AXB-MH combines the controller and driver functions required to handle OIS in smartphone camera modules. The significantly improved shutter speeds make exposure compensation far superior to competing OIS solutions. Therefore, it can achieve precise control of the vibration of the camera screen. In addition, it can also be used to achieve the left, right, and up and down adjustment functions that are indispensable when walking. The output of this integrated IC pulse width modulation (PWM) driver reduces power consumption and mitigates the effects of noise on image quality. This highly integrated, pre-programmed IC allows engineers to minimize the number of external components required in the system design, thereby reducing overall power consumption and board area.
"The need to upgrade the camera performance of the latest smartphones is increasing day by day as consumers expect better and better camera functions," said Tomoe Watanabe, director of the Power Solutions Product Business Unit of ON Semiconductor's Smart Power Solutions Division. A higher resolution CMOS image sensor with even higher OIS accuracy.This compact, highly advanced, energy-efficient single-chip solution helps design smarter smartphones that are slimmer but more versatile.This innovative LC898111AXB-MH IC It has been adopted by leading smartphone manufacturers and is currently being used in smartphones with the highest resolution in the market today."
The LC898111AXB-MH incorporates a variety of digital and analog audio processing mechanisms, including dual channel position sensing circuitry, gyro filter interface circuitry, and lens servo circuitry. The position sensing circuit includes a Hall amplifier circuit, a constant current digital-to-analog converter (DAC), a gain control operational amplifier, and a 12-bit analog-to-digital converter (ADC) for each channel. The gyro filter interface circuit is fully compatible with analog and digital signals. The gyro filter interface and the lens servo circuit can be adjusted through the I2C and SPI bus interfaces, and can provide various configurations when connecting different gyros and actuators. Therefore, the device can cover a wider range of tremor frequency and thus provide a larger image stabilization angle.
ON Semiconductor plans to expand this series of products to develop the industry's smallest chip size (2.0mm X 2.0mm X 0.675mm only) and LC898119XC-MH, which offers extremely low power consumption. Samples are available now.
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