[ High-tech LED reporter / Wang Cairong ] Recently, Shenzhen Jingtai Optoelectronics Co., Ltd. "Drive Efficient Light" product promotion conference was successfully held in Guangzhou. At the meeting, Jingtai Optoelectronics fully demonstrated the LED packaging front-end technology and the latest device products in the three major fields of LED lighting, full-color display series and 3C series, attracting a large number of new and old customers to participate.
Founded in 2008, Jingtai Optoelectronics Co., Ltd. has a investment scale of 200 million yuan. It is a high-tech enterprise specializing in research and development, production of SMD LED, high-power LED, product positioning in the high-end LED application market, focusing on LED packaging technology and manufacturing.
As of the end of 2012, the Jingtai Optoelectronics production base has an area of ​​12,000 square meters and nearly 800 employees. In 2012, the company's total output value exceeded 300 million yuan. “The company plans to achieve an annual output value of 1 billion yuan by 2015.†Zhang Yuan, director of Jingtai Optoelectronics Market, said at the promotion meeting.
According to Zhang Yuan, Jingtai Optoelectronics introduced advanced ASM automatic die bonding machine, automatic wire bonding machine, molding machine, automatic cutting machine, SMD LED automatic beam splitter, SMD LED automatic loading machine, environmental testing machine, high precision. More than 600 machines in world-class automatic production lines such as optical analysis systems and computer analysis microscopes.
"At present, the monthly production capacity has exceeded 1000 KK / month. The company has made new breakthroughs in the research and development of high-efficiency COB-MLCOB, small-sized power EMC light source and cost-effective COB light source solution. The overall production and operation scale is in the forefront of the domestic packaging industry." Zhang Yuan said.
Complete package products, unique design and leading peers
At the promotion meeting, Jingtai Optoelectronics displayed a full range of COB products represented by the new MLCOB (third generation COB packaging technology), including high-power LEDs, medium-power LEDs and other devices used in lighting products. As the third generation packaging technology, MLCOB has the biggest advantage to effectively improve the light efficiency.
Jingtai Optoelectronics Zhang Lei said that the current mass production of MLCOB products is 160lm/w, and the data in the laboratory exceeds 200lm/w. At the same time, MLCOB takes into account the other advantages of COB. For example, good heat dissipation, MLCOB thermal resistance can reach 5 ° C / W, easy to install, no thermal damage.
“The difference with traditional COB is that MLCOB has a unique reflector design and uses multi-prism secondary optics. These two technologies combined with the traditional application of traditional COB technology make the light efficiency of MLCOB products improve on the traditional basis. 30%-40%.†Zhang Lei said that MLCOB focuses on the high-end market, and the main demand for LED lighting applications in the future will focus on high luminosity, high reliability and high heat dissipation.
Zhang Maoneng, director of R&D at Jingtai Optoelectronics, pointed out at the promotion meeting that the factors affecting LED products entering indoor lighting include price, reliability, standards and performance.
At the meeting, he also introduced EMC LED (Epoxy Molding Compound LED) products, including 2835, 3014, 3020, 3030 four market mainstream specifications.
Among them, the medium power 2835 has a new package structure and a heat sink design; it can realize high power product packaging of 0.2w and 0.5w; high luminous efficiency and high brightness, display light efficiency up to 120lm/w; small size, LED finished product arrangement It can be more dense, and the application light effect is more uniform.
Ten major trends in LED packaging technology
At the promotion meeting, Gong Wen, general manager of Jingtai Optoelectronics, summarized the top ten trends and hot spots of LED packaging technology in China in the future:
1. Medium power has become the mainstream packaging method. At present, most of the products on the market are high-power LED products or low-power LED products. Although they have their own advantages, they also have insurmountable defects. The medium-power LED products that combine the advantages of both have emerged as the mainstream packaging method.
2. The application of new materials in packaging. Materials such as thermoset materials EMC, thermoplastic PCT, modified PPA, and ceramic-like plastics will be widely used due to higher and better environmental tolerances such as high temperature resistance, UV resistance, and low water absorption.
3. Chip super current density application. In the future, the chip's ultra-current density will grow from 350MA/mm2 to 700MA/mm2 or even higher. The chip demand voltage will be lower, a smoother VI curve (lower heat), and ESD and VF.
4. Popularization of COB applications. With the advantages of low thermal resistance, good light quality, solder-free and low cost, COM applications will be widely used in the future.
5. The demand for higher light quality. Mainly for indoor lighting, Jingtai Optoelectronics will use the LED indoor lighting product RA to reach 80 as the standard, and RA to achieve the goal of 90. Try to make the light color of the lighting product close to the Plank curve, so that the light can be even and glare-free. .
6. International and domestic standards are further improved. It is believed that with the continuous improvement of LED packaging technology, the quality standards for LED products in China and internationally will continue to improve.
7. Integrated packaged light engine becomes the package value. The integrated packaged light engine will become the focus of the next season of the company.
8, go to the power solution (high voltage LED). In the future, indoor lighting will pay more attention to quality, and driven by cost factors, the power supply scheme will gradually become an acceptable product, and the high-voltage LED fully caters to the power-off scheme, but the need to solve the problem is that the chip reliability needs to be strengthened.
9. Multi-color LED light source for scene lighting. Scenario lighting will be the core competitiveness of LED lighting, and the second take-off of future LED lighting needs to rely on scene lighting to achieve.
10, the light efficiency demand is relatively reduced, cost-effective has become a magic weapon for the packaging factory. In the future, indoor lighting will not pay too much attention to light efficiency, but will pay more attention to the quality of light. With the improvement of packaging technology, the cost of LED lamps has become a power to replace traditional lighting sources. In the process of entering home lighting, the price/performance ratio will be more and more valued by customers.
Founded in 2008, Jingtai Optoelectronics Co., Ltd. has a investment scale of 200 million yuan. It is a high-tech enterprise specializing in research and development, production of SMD LED, high-power LED, product positioning in the high-end LED application market, focusing on LED packaging technology and manufacturing.
As of the end of 2012, the Jingtai Optoelectronics production base has an area of ​​12,000 square meters and nearly 800 employees. In 2012, the company's total output value exceeded 300 million yuan. “The company plans to achieve an annual output value of 1 billion yuan by 2015.†Zhang Yuan, director of Jingtai Optoelectronics Market, said at the promotion meeting.
According to Zhang Yuan, Jingtai Optoelectronics introduced advanced ASM automatic die bonding machine, automatic wire bonding machine, molding machine, automatic cutting machine, SMD LED automatic beam splitter, SMD LED automatic loading machine, environmental testing machine, high precision. More than 600 machines in world-class automatic production lines such as optical analysis systems and computer analysis microscopes.
"At present, the monthly production capacity has exceeded 1000 KK / month. The company has made new breakthroughs in the research and development of high-efficiency COB-MLCOB, small-sized power EMC light source and cost-effective COB light source solution. The overall production and operation scale is in the forefront of the domestic packaging industry." Zhang Yuan said.
Complete package products, unique design and leading peers
At the promotion meeting, Jingtai Optoelectronics displayed a full range of COB products represented by the new MLCOB (third generation COB packaging technology), including high-power LEDs, medium-power LEDs and other devices used in lighting products. As the third generation packaging technology, MLCOB has the biggest advantage to effectively improve the light efficiency.
Jingtai Optoelectronics Zhang Lei said that the current mass production of MLCOB products is 160lm/w, and the data in the laboratory exceeds 200lm/w. At the same time, MLCOB takes into account the other advantages of COB. For example, good heat dissipation, MLCOB thermal resistance can reach 5 ° C / W, easy to install, no thermal damage.
“The difference with traditional COB is that MLCOB has a unique reflector design and uses multi-prism secondary optics. These two technologies combined with the traditional application of traditional COB technology make the light efficiency of MLCOB products improve on the traditional basis. 30%-40%.†Zhang Lei said that MLCOB focuses on the high-end market, and the main demand for LED lighting applications in the future will focus on high luminosity, high reliability and high heat dissipation.
Zhang Maoneng, director of R&D at Jingtai Optoelectronics, pointed out at the promotion meeting that the factors affecting LED products entering indoor lighting include price, reliability, standards and performance.
At the meeting, he also introduced EMC LED (Epoxy Molding Compound LED) products, including 2835, 3014, 3020, 3030 four market mainstream specifications.
Among them, the medium power 2835 has a new package structure and a heat sink design; it can realize high power product packaging of 0.2w and 0.5w; high luminous efficiency and high brightness, display light efficiency up to 120lm/w; small size, LED finished product arrangement It can be more dense, and the application light effect is more uniform.
Ten major trends in LED packaging technology
At the promotion meeting, Gong Wen, general manager of Jingtai Optoelectronics, summarized the top ten trends and hot spots of LED packaging technology in China in the future:
1. Medium power has become the mainstream packaging method. At present, most of the products on the market are high-power LED products or low-power LED products. Although they have their own advantages, they also have insurmountable defects. The medium-power LED products that combine the advantages of both have emerged as the mainstream packaging method.
2. The application of new materials in packaging. Materials such as thermoset materials EMC, thermoplastic PCT, modified PPA, and ceramic-like plastics will be widely used due to higher and better environmental tolerances such as high temperature resistance, UV resistance, and low water absorption.
3. Chip super current density application. In the future, the chip's ultra-current density will grow from 350MA/mm2 to 700MA/mm2 or even higher. The chip demand voltage will be lower, a smoother VI curve (lower heat), and ESD and VF.
4. Popularization of COB applications. With the advantages of low thermal resistance, good light quality, solder-free and low cost, COM applications will be widely used in the future.
5. The demand for higher light quality. Mainly for indoor lighting, Jingtai Optoelectronics will use the LED indoor lighting product RA to reach 80 as the standard, and RA to achieve the goal of 90. Try to make the light color of the lighting product close to the Plank curve, so that the light can be even and glare-free. .
6. International and domestic standards are further improved. It is believed that with the continuous improvement of LED packaging technology, the quality standards for LED products in China and internationally will continue to improve.
7. Integrated packaged light engine becomes the package value. The integrated packaged light engine will become the focus of the next season of the company.
8, go to the power solution (high voltage LED). In the future, indoor lighting will pay more attention to quality, and driven by cost factors, the power supply scheme will gradually become an acceptable product, and the high-voltage LED fully caters to the power-off scheme, but the need to solve the problem is that the chip reliability needs to be strengthened.
9. Multi-color LED light source for scene lighting. Scenario lighting will be the core competitiveness of LED lighting, and the second take-off of future LED lighting needs to rely on scene lighting to achieve.
10, the light efficiency demand is relatively reduced, cost-effective has become a magic weapon for the packaging factory. In the future, indoor lighting will not pay too much attention to light efficiency, but will pay more attention to the quality of light. With the improvement of packaging technology, the cost of LED lamps has become a power to replace traditional lighting sources. In the process of entering home lighting, the price/performance ratio will be more and more valued by customers.
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